SUMIDIA
M2
General Features
SUMIDIA is a unique series of sintered polycrystalline diamond
grades, namely, DA90, DA150, DA2200 and DA1000.
The lineup covers a wide range of applications. DA90, DA150
and DA2200 use optimal combinations of diamond grain size and
binder to produce their own individual characteristics, while DA1000
provides excellent strength, wear resistance and sharpness.
Performance
10 20 30 40
0.1
0
DA90 Competitor's PCD
0.2
0.05
0.10
0.15
1 2 3 4
DA90
DA150
0.05
0
0
0.10
DA90
DA1000
DA150
Al-25% Si Alloy Continuous
Cutting Test Result
MMC (Al-20% SiC) Interrupted
Cutting Test Result
Competitor 2
Competitor
Competitor1
v
c
=500m/min
f=0.1mm/rev
a
p
=0.2mm
Dry
Insert : SPGN120304
Holder : FP11R
Grade
Carbide Cutting Test Result
v
c
=350m/min
f =0.2mm/rev
a
p
=0.18mm
Wet
Insert : CNMX120408
Holder : PCLN2525
84w/o WC-Co-Ni
(HRA=83.2)Cutting
v
c
=15m/min f=3.7mm/rev
a
p
=0.5mm Dry
1 Pass (After 13 Minutes Cutting)
Flank Wear Width (mm)
Cutting Distance (km)
Flank Wear Width (mm)
Cutting Distance (km)
Flank Wear Width (mm)
Series / Characteristics / Application
Grades Characteristics Application
Average Size of
Diamond Grains
(μm)
Hardness
HV (GPa)
TRS (GPa)
DA1000
High density sintered material made of
ultrafine diamond particles that demonstrates
optimum wear and fracture resistance, and
excellent edge sharpness.
· High-Silicon Aluminium Alloy Cutting
· Rough, Interrupted and Finishing of Al-alloy
· Wood or Wooden Board Cutting
· Non-Ferrous Metal finishing
(Aluminium, Copper Alloy)
Up to 0.5
110
to
120
2.6
DA2200
Sintered material made of ultra-fine diamond
particles that demonstrates optimum wear and
fracture resistance, and excellent edge sharpness.
· Rough, Interrupted and Finishing of Al-alloy
· Wood or Wooden Board Cutting
0.5
90
to
100
2.45
DA150
Micro-grained sintered diamond grade with
strong diamond-to-diamond bonding. It is
suitable for the machining of non-ferrous metals
and other very hard materials.
· Non-Ferrous Metal finishing
(Aluminium, Copper Alloy)
·
Carbide or Semi-Sintered Carbide & Ceramic Roughing
· FRP, Hard Rubber & Carbon Cutting
· Wooden or Inorganic Material Board Cutting
5
100
to
120
1.95
DA90
Contains coarser diamond grains than other
grades. Therefore, it has good wear resistance
suitable for the machining of carbides and high
silicon aluminium.
· High-Silicon Aluminium Alloy Cutting
· Sintered Carbide Cutting
· Carbide Cutting
·
Green or Semi-Sintered Carbide & Ceramic Roughing
· Sintered Ceramic Cutting
· Stone or Rock Cutting
Up to 50
100
to
120
1. 1 0
Recommended Cutting Conditions
Work Material
Cutting Speed
v
c
(m/min)
Feed Rate
f (mm/rev)
Depth of Cut
a
p
(mm)
Aluminium Alloy
Up to
3,000
Up to
0.2
Up to 3
Copper Alloy
Up to
1,000
Up to
0.2
Up to 3
Reinforced Plastics
Up to
1,000
Up to
0.4
Up to 2
Wood or Organic
Materials
Up to
4,000
Up to
0.4
Carbide
10 to 30
Up to
0.2
Up to
0.5
Carbon
100 to
600
1 Up to 2
SUMIDIA Grinding Method
Functions Remarks
Grinding Machine
A rigid, special-purpose grinding machine that is capable of wet grinding operations.
Grinding
Wheel
Abrasive Grain Diamond
Grain Size Rough Grinding: 400 mesh Finish Grinding: 800 to 1,500 mesh
Bond Special Purpose Metal Bond for Diamond Sintered Tool or Vetriffied
Concentration 100 to 125
Dressing Use a WA stick of about 400mesh
Grinding
Conditions
Peripheral Speed
800 to 1,000 m/min
Table Rocking 30 to 60 cycle/min
Grinding Liquid
Coolant Water Soluble Grinding Coolant (Solution Type)
Others
(1) The rake surface is generally lapped.
(2)
Inspect for edge chipping using a microscope with a magnification of 30 to 50 times.
(3) Machining of non-ferrous metals require a sharp cutting edge.
(4) Surfaces that were cut by EDM should have more than 0.05mm ground off.
Polycrystalline Diamond
SUMIDIA
Series
M
SUMIDIA
SUMIDIA
Binderless
SUMI
CRYSTAL