SUMIDIA
M2
General Features
SUMIDIA is a polycrystalline diamond material developed by using our
proprietary technologies.
SUMIDIA is available in 4 grades (DA90, DA150, DA2200 and DA1000), each
having different characteristics depending on the size of the diamond grains
and the combination of binder materials.
In addition, a new grade (NPD10) made by nano-level diamond grains without
binder material with direct conversion sintering has been newly added to our
product line.
SUMIDIA can be used for all types of applications, from machining
aluminum alloys to brittle materials such as carbide.
Cutting Performance
Grades / Features / Applications
Grade Features Applications
Average Size of
diamond Grains
(μm)
Hardness HV
(GPa)
TRS
(GPa)
SUMIDIA
Binderless
NPD10
A 100% diamond grade made by nano-
level diamond grains with direct conversion
sintering. Has the highest wear resistance
and fracture resistance, and the best edge
sharpness.
Surface finishing of carbide
Machining brittle materials (ceramics) up to 0.05
120
to
130
≈ 3.15
SUMIDIA
DA1000
Made by sintering super fine-grained
diamond at high densities. Has excellent
wear resistance, fracture resistance, and
edge sharpness.
High silicon aluminum alloy machining
Rough machining / interrupted machining / surface
finishing of aluminum alloys
Woodworking, cutting / face machining of wood and
wooden boards
General surface finishing of non-ferrous metals
up to 0.5
110
to
120
≈ 2.60
DA2200
Made by sintering super fine-grained
diamond. Has a good balance of wear
resistance and fracture resistance, and has
excellent edge sharpness.
Rough machining / interrupted machining / surface
finishing of aluminum alloys
Woodworking, cutting / face machining of wood and
wooden boards
0.5
90
to
100
≈ 2.45
DA150
A grade made by sintering fine-grained
diamond. Diamond grains are firmly joined
together. Has an excellent balance of
machinability and wear resistance.
General surface finishing of non-ferrous metals
Surface finishing of pre-sintered ceramic parts and
stamped parts
Machining FRP, hard rubber, and carbon
Cutting/face machining of wooden and inorganic boards
5
100
to
120
≈ 1.95
DA90
A grade made by sintering rough-grained
diamond. Contains the highest amount of
diamond. Has excellent wear resistance.
High silicon aluminum alloy machining
Machining of aluminum composite materials
Rough machining of carbide, pre-sintered ceramic parts,
and stamped parts.
Machining of sintered ceramic parts, machining of stone /
rock
up to 50
100
to
120
≈ 1. 10
Polycrystalline Diamond Tools
SUMIDIA Series
SUMIDIA
SUMIDIA Binderless
SUMICRYSTAL
M
Work material: Al-25% Si alloy
Insert: SPGN120304
Holder: FP11R
Cutting conditions: vc = 500 m/min, f = 0.1 mm/rev,
ap = 0.2 mm, Dry
Work material: MMC (Al-20% SiC)
Insert: CNMX120408
Holder: PCLN2525
Cutting conditions: vc = 350 m/min, f = 0.2 mm/rev,
ap = 0.18 mm, Wet
Work material: Carbide (87HRA)
Insert: DCMW11T304RH
Holder: SDJC2020
Cutting conditions: vc = 20 m/min, f = 0.1 mm/rev,
ap = 0.1 mm, Dry
10 20 30 40
0.05
0
0.10
DA90
DA1000
DA150
Cutting distance (km)
Al-25% Si alloy continuous cut test results
Competitor B
Competitor A
Frank Wear Width
(mm)
DA90
NPD10
100 200 300 400
0.1
0.2
0.3
0
VB=0.171mm
VB=0.034mm
Cutting distance (km)
Carbide (87HRA) continuous cut test results
Frank Wear Width
(mm)
0.05
0.10
0.15
1234
DA90
DA150
0
Cutting distance (km)
MMC (Al-20% SiC) continuous cut test results
Competitor
Frank Wear Width
(mm)